| 초록 |
Demand of functional pressure sensitive adhesives (PSAs) is increasing especially in the electronic industry. PSAs in electronic devices need a number of functionalities such as heat resistance and high adhesive strength. The heat resistance of PSAs is an important factor in electronic device since PSAs give a fetal influence on the durability of electronic device unless PSAs withstand the generated heat by electronic devices. In order to improve the heat resistance of PSAs, the curing agent containing a fluorene structure was incorporated in preparation of PSAs. The base polymer of PSAs was synthesized using 2-ethylhexyl acrylate, ethyl acrylate, and acrylic acid. The base polymer and glycidyl methacrylate were further react with the curing agent. The mixed solution of base polymer, curing agent and photoinitiator was coated on PET film followed by irradiation with UV light. Properties of the prepared PSAs were analyzed by various analytical instruments. |
