| 학회 | 한국고분자학회 |
| 학술대회 | 2007년 가을 (10/11 ~ 10/12, 일산킨텍스) |
| 권호 | 32권 2호 |
| 발표분야 | 고분자 가공/복합재료 |
| 제목 | Effects of Nano Fumed Silica on Material Properties of Non-Conductive Adhesives for Chip-Stacking |
| 초록 | Thermo-mechanical properties of NCAs(Non-Conductive Adhesives) depending on nano fumed silica filler contents were investigated. As the filler contents increased, thermo-mechanical properties of NCAs were changed. The higher the filler content was added, glass transition temperature(Tg) became higer. While, coefficient of thermal expansion(CTE) decreased. |
| 저자 | 이동현, 임지윤, 김대흠 |
| 소속 | 광운대 |
| 키워드 | Chip-Stacking; NCA; Nano Fumed Silica |
