| 학회 |
한국고분자학회 |
| 학술대회 |
2011년 봄 (04/07 ~ 04/08, 대전컨벤션센터) |
| 권호 |
36권 1호 |
| 발표분야 |
고분자가공/복합재료 |
| 제목 |
Effect of the silica particles on the electrical conductivity and thermomechanical property of epoxy/silver nanoparticles composite |
| 초록 |
In this study, novel approach to decrease the contact resistance and coefficient of thermal expansion(CTE) of epoxy/Ag nanocomposites using silica particles has been introduced. Silver nanoparticles used as conductive fillers were replaced with silica particles because silica has been known to control the rheology of organic/inorganic hybrids and the reinforcement of polymer matrices. This study described herein concerns the effect of silica concentration and silica particle size on electrical resistivity, rheological property and thermomechanical property such as CTE of epoxy/Ag nanocomposites. In the electrical conductivity, epoxy/Ag nanocomposite with 18vol% Ag nanoparticles shows 4.7×10-4Ωcm after addition of 12vol% silica particles to this nanocomposite. In the thermomechanical study, silica-added the epoxy/silver nanoparticles composite, CTE of nanocomposites was decreased to 32.9 ㎛/m℃. |
| 저자 |
남승웅1, 유호연1, 성봉준2, 김대흠3, 김희숙1, 임순호1
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| 소속 |
1한국과학기술(연), 2서강대, 3광운대 |
| 키워드 |
silver; silica; electrical conductivity
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| E-Mail |
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