| 학회 | 한국고분자학회 |
| 학술대회 | 2003년 봄 (04/11 ~ 04/12, 연세대학교) |
| 권호 | 28권 1호, p.124 |
| 발표분야 | 고분자 구조 및 물성 |
| 제목 | Synthesis and characterization of copoly(epoxy-imide) films |
| 초록 | For the chemical reaction between polyimide and epoxy, the hydroxyl-containing fully aromatic soluble copolyimides based on 2,2-bis(3,4’-dicarboxyfluoropropane) (6FDA), 2,2-bis(3-amino-4-hydroxylphenyl)-hexafluoropropane (AHHFP), and 4,4'-Oxydianiline(ODA) were prepared by chemical imidization method with different AHHFP/ODA ratio. Bihenyl type epoxy resin (4,4’-diglycidyloxy-3,3’,5,5’-tetramethyl biphenyl), phenol novolac resin(PN), and triphenyl phosphite(TPP) were mixed in NMP with copolyimides and cured at 150°C for 1h, 250°C for 2h on silicon wafer. Thermal, dielectric, and residual stress properties of the copoly(epoxyimides) was investigated by TGA, TFDA(Thin Film Dielectric property Analyzer) and TFSA (Thin Film Stress Analyzer) respectively. In addition, the morphology of copoly(epoxyimides) were studied by Prism-Coupler. Acknowledgment: This work was supported by Korea Research foundation Grant.(KRF-2001-041-E00332) |
| 저자 | 김상욱;양승진;이춘근;한학수 |
| 소속 | 연세대 |
| 키워드 | soluble polyimide; epoxy modification; residual stress |
