| 학회 |
한국고분자학회 |
| 학술대회 |
2009년 가을 (10/08 ~ 10/09, 광주과학기술원 오룡관) |
| 권호 |
34권 2호 |
| 발표분야 |
고분자 가공/복합재료 |
| 제목 |
Adhesive joining process and wetting Characteristics of conductive Particle for anisotropic conductive adhesive |
| 초록 |
The optimum adhesive joining process of anisotropic conductive adhesive (ACA) with low melting point alloy (LMPA) filler was designed for the high performance and reliability in the ACA system using chemo-rheological analysis of ACA resin. The curing degree of the polymer matrix and the melting of the LMPA filler particle were investigated by dynamic mode of differential scanning calorimetry (DSC). The temperature dependant viscosity characteristic of polymer matrix was also investigated using rheometer. It is believed that the wetting and coalescence behavior of the filler particles leads to the production of the interconnection between the electrodes. Three kinds of carboxylicacid were added to remove the oxide layer on the surface of filler particle and the conductive pad. The good wetting properties were achieved between the LMTA filler and the Au pad in the polymer matrix with these carboxylic acids. |
| 저자 |
김효미, 김주헌
|
| 소속 |
중앙대 |
| 키워드 |
ACA; polysiloxane; carboxylicacid; coalescence
|
| E-Mail |
|
