| 학회 |
한국재료학회 |
| 학술대회 |
2016년 봄 (05/18 ~ 05/20, 여수 디오션리조트 ) |
| 권호 |
22권 1호 |
| 발표분야 |
E. 환경/센서 재료분과 |
| 제목 |
Highly Thermal Conductive Alumina Plate/Epoxy Composite for Electronic Packaging |
| 초록 |
In this study, alumina plates 9~25m in size were used as thermal fillers, and epoxy resin was used as a polymer matrix. Oriented alumina plate/epoxy composites were prepared using a rolling method. The effect of ordering alumina plates increased with alumina plate size. The thermal conductivity and flexural strength of the composites were investigated. The horizontal thermal conductivity of the oriented composite was significantly higher than the vertical thermal conductivity. The horizontal thermal conductivity of the 75wt% alumina content was 8.78 W/mk, although the vertical thermal conductivity was 1.04 W/mk. Ordering of the alumina plate using a rolling method significantly improved the thermal conductivity in the horizontal direction. The flexural strengths of the ordered alumina/epoxy composites prepared at different curing temperatures were measured. |
| 저자 |
허석, 정운성, 이윤주, 신동근, 권우택, 김수룡, 임형미, 김영희
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| 소속 |
한국세라믹기술원 |
| 키워드 |
alumina plate; thermal conductivity; alumina/epoxy composite
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| E-Mail |
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