| 초록 |
Pressure sensitive adhesive (PSA) does not require additional chemical processing and has the property of easily bonding with light pressure. Because it can be applied to a variety of adherends, the demand for high-performance adhesives such as waterproofing tapes, insulating tapes, and dicing tapes in high-tech industries is increasing. In the past, wax was used in the semiconductor chip dicing process, but adhesive tape is now used due to wafer damage and environmental problems. Afterwards, due to peeling and adhesive residue issues, UV-curable adhesive tapes were developed and used. The tape for the dicing process requires a strong adhesive strength before UV curing to protect the wafer and a low adhesive strength for easy peeling after curing. In this study, a photocuring functional groups were introduced into the acrylic polymer through urethane reaction. And the change of properties before and after UV was examined and the possibility as an tape for dicing was investigated. |
