| 초록 |
Photosensitive dielectric material has been investigated for interconnection of embedded active device. Photosensitive dielectrics are materials that, when exposed to ultraviolet light, polymerize and cross-link to reach a state where they will not dissolve when sprayed with solvents or mild aqueous alkaline solutions. If the via holes are not exposed due to photomasks, then when processed they are dissolved away by the developer. These kind of vias are called photo-vias. There are some advantages of this type of process including the ability to produce all vias in a batch process (mass via formation), high resolution, high registration and the ability to form smaller vias compared with conventional methods. Both of Liquid and dry film type photosensitive dielectric were used in formation of micro-via between die pad and PCB layer. As a result of optimizing the coating method, exposure dose, cure conditions and developing conditions, 50 um vias were obtained with good reliability. |
