| 학회 |
한국공업화학회 |
| 학술대회 |
2015년 봄 (04/29 ~ 05/01, BEXCO (부산)) |
| 권호 |
19권 1호 |
| 발표분야 |
접착제도료잉크_포스터 |
| 제목 |
Low-temperature Curable Conductive Pastes for High Heat Dissipation |
| 초록 |
To investigate highly thermal conductive pastes, trimodal metallic mixture of micron-sized silver flakes, silver microspheres and silver nanoparticles was incorporated into the epoxy matrix. Our strategy to make a good metallic pathway is that sintering temperature of silver particles designs lower than the curing temperature of epoxy resins. The use of nano-sized conductive fillers leads to the low temperature sintering between silver particles due to the melting point depression with decrease of nanoparticle size. Thermal behavior of the conductive paste have been characterized by differential scanning calorimeter (DSC) and the laser flash analysis (LFA). We found that our silver pastes exhibited the highly thermal conductivity at a relatively low curing temperature of below 200 ℃. The conductive pastes could be a promising candidates for applications as interconnecting layer on polymer substrates and as the heat dissipation material for electronic devices such as light emitting diodes (LEDs). |
| 저자 |
최혜림, 박성대, 임호선
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| 소속 |
전자부품(연) |
| 키워드 |
Conductive paste; Low temperature
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| E-Mail |
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