| 학회 |
한국공업화학회 |
| 학술대회 |
2021년 봄 (05/12 ~ 05/14, 부산 벡스코(BEXCO)) |
| 권호 |
25권 1호 |
| 발표분야 |
포스터-디스플레이 |
| 제목 |
Improved Thermal Conductivity in Mixture of Modified Curing Agents/Epoxy Composites/Hexagonal Boron Nitride for Insulating Thermal-Conductive Composites |
| 초록 |
Recently developments in the dissipation have heighted the need for advanced polymeric thermal conductive composite with inexpensive, easy handling, prominent workability and outstanding mechanical properties, However, current problems with polymers is a low thermal conductivity in the range of 0.10-0.25 W m-1 K-1. Here, we report on biphenyl curing agents, there are stronger interaction between the molecules due to the double bonds in the phenyl rings. We have designed a novel epoxy resins hearing biphenyl mesogenic groups and improving the thermal properties of new diamines with biphenyl groups as hardener for thermally conductive composites. Our results illustrate the potential to achieve high thermal conductivity in curing agents and control its thermal conductivity, opening avenues for the wide application of h-BN composites as a next-generation material for thermal dissipation. |
| 저자 |
강주희, 임종태, 석웅철, 서민혜, 이상국, 송호준
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| 소속 |
한국생산기술(연) |
| 키워드 |
hexagonal boron nitride; thermal conductivity; epoxy resins
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| E-Mail |
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