| 초록 |
Polyimide(PI) is a high-strength, chemical resistant, heat-resistant polymer with thermal stability based on rigid aromatic castings. Its excellent electrical properties, such as insulation properties and low dielectric rates, are widely seen as high-functioning polymer materials, ranging from microelectronics to optics, and can be applied to parts operating in high temperatures such as nose cone, gas structure. In general, Polybenzoxazole(PBO) has higher heat resistance than PI. However, PBO and the precursor Polyhydroxyamide are also difficult to use because they are not easy to dissolve. In this study, to enhance the heat resistance characterisitcs of PI, we synthesized two types of diamine monomers introduced by the Benzoxazole unit and used them to produce nine types of PI films. it was confirmed through NMR that Diamine was synthesized, PI films were analyzed through FT-IR. Thermal properties of film were analyzed through TGA and mechanical properties were analyzed through UTM. |
