| 초록 |
Many kinds of materials for electronic application are probably the class of materials with the widest variety of functionalities. In this study, the supercritical fluid technology is applied to effectively functionalize polyimide materials. In this approach, we have studied about electronic materials like low dielectric constant materials with porous polyimide films using the advanced technology. The low dielectric porous thin film for interlayer dielectric applications in microelectronics is essential that the layer of the integrated circuits maintains its specific electrical, physical, and chemical properties after incorporation in the device structure and during subsequent processing. The porous polyimide thin films were obtained by utilizing supercritical CO2 and by-product (CO2) where the polyimide thin film was derived from 4,4-(hexafluoroisopropylidene)diphthalic anhydride (6FDA) with 4,4-methylenebis(phenyl isocyanate) (MDI). SEM studies showed the cross-section image of porous polyimide thin fi. A dielectric constant was estimated for a porous polyimide thin film with an porosity of 40%. Electrical and mechanical properties as well as coefficient of thermal expansion for both dense and porous polymer films were measured.
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