화학공학소재연구정보센터
학회 한국공업화학회
학술대회 2010년 가을 (10/27 ~ 10/29, 대전컨벤션센터)
권호 14권 2호
발표분야 접착제.도료.잉크
제목 Conductive mechanism of Polymer/Mesoporous Carbon Adhesives with Low Percolation Threshold
초록 Conductive transparent adhesiveswere prepared using mesoporous carbon material (MCM), CMK-3(150), as a conductive filler with high ordered~ 10 nm pore diameter. The polar acrylate and CMK-3(150) adhesive composite was adherent on various surface including ITO film, to afford highly transparent and adhesive film. The percolation concentration of the CMK-3(150) in the composite was determined as ~ 7 % which is much less than a typical conductive filler. Thetemperature dependence of the conductivity in the polymer/CMK adhesives indicated that the conduction mechanismcould be explained through hopping conduction along MCM.
저자 김병관, 김정훈, 김은경
소속 연세대
키워드 acrylate adhesive; electrically conductive adhesive; optically clear adhesive; carbon mesoporous material; CMK
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