| 초록 |
As electronic devices become smaller and higher performance, heat generation is becoming an important issue. Accordingly, a demand for materials capable of efficiently and rapidly releasing heat is rapidly increasing. Because silicon carbide (SiC) has excellent thermal conductivity and thermal stability, it has been widely investigated as a functional nanomaterial in the heat release management. In this study, we had fabricated a series of thin films based on SiC and polyimide (PI) via solution casting and following heat treatment. The molecular and morphological structures of SiC/PI-based nanocomposite films were characterized with aids of FT-IR, SEM, and TEM. The thermal stability, thermal conductivity, and mechanical property of the nanocomposite films were investigated by using TGA, LFA, and DMA, respectively. The thermal and mechanical properties of the nanocomposite films was discussed in aspects of the SiC content and the microstructural features. |
