| 초록 |
In the semiconductor manufacturing processes, a number of flammable, toxic, and corrosive hazardous materials are used as specialty gas, and are delivered to manufacturing facilities through separate supply systems and pipelines. Thus, pipelines need to be cleaned before being demolished. Residual gas removal in the pipe is carried out by certain methods which are considerably time-consuming including vacuum pumping and purging steps. Therefore, understanding cleaning dynamics and developing efficient cleaning methods are important to enhance and ensure the productivity and safety.In this study, an effective method of removing residual gas in the pipelines was studied through the CFD simulation. The gases used in semiconductor processes were selected, considering their physical properties such as density and viscosity. High vacuum condition generated by a pump and N2 gas purge was implemented, and the region with a high residual gas concentration in the pipe structure was visualized. Through the CFD simulation, the cleaning method under various conditions, which is difficult to be proceeded in the scale of laboratory, could be observed in a relatively short time. |
