| 초록 |
Among polymers, Polyimide (PI) is widely used in electronic devices, semiconductor devices, and printed circuit board industries because of its excellent glass transition temperature, dimensional stability and heat resistance, dielectric properties, and metal adhesion. In terms of the design of the monomer, an amide unit was introduced into the new monomer to impart heat resistance to the existing PI. A yield of over 90% was obtained in the monomer synthesis, and TFMB and copolymer synthesis were performed based on one type of dianhydride. Six types of polyimide copolymer films were synthesized through thermal imidization, and PI Film was analyzed through Fourier Transform Infrared Spectroscopy (FT-IR). The thermal properties of the film were analyzed through a thermal gravimetric analyzer (TGA), and the mechanical properties were analyzed through UTM. In addition, we have also measured Coefficient of Thermal Expansion (CTE), and we will proceed with the study for a lower CTE value. |
