| 초록 |
Polyimides (PIs) are well-known as a promising candidate of electronic packaging materials because of their excellent thermal and mechanical properties, and low dielectric constant. Recently, based on these properties, highly thermally conductive PI composites containing conductive fillers such as silver nanowire (AgNW), boron nitride (BN) have been developed for application to electronic packaging materials. However, PI is generally manufactured via poly(amic acid) (PAA) intermediates using toxic solvents such as DMAc, DMF, and NMP. Moreover, these organic solvents cause disadvantages in economical and environmentally-benign view. In this study, we report the eco-friendly and low-cost preparation method of highly thermally conductive PI/BN composite powders. In addition, to demonstrate the practical applicability, compression-molded specimens with PI/BN composite powders were prepared, and their thermal conductivities were examined. |
