| 학회 | 한국화학공학회 |
| 학술대회 | 2009년 봄 (04/23 ~ 04/24, 광주 김대중컨벤션센터) |
| 권호 | 15권 1호, p.58 |
| 발표분야 | 고분자 |
| 제목 | Delectric constant and Adhesion on Cu by the Effect of Polyimide with MCM-41 |
| 초록 | A new type of polyimide (PI) / MCM-41 (Mobile Crystalline Material) hybrid composite films were prepared by blending nano-size MCM-41 particle with synthesized PI. PI were synthesized from by 4,4’-Oxydianiline (ODA) and 3,3’-4,4’-Benzophenone tetracarrboxylic dianhydride (BTDA) through chemical imidization method.. This synthesized PI were blended with nano sized MCM-41 changing the amount of the silica .These composite films were successfully characterized for confirming the properties by the FT-IR. And the thermal properties were also evaluated using the TGA and TMA. Residual stress to copper substrate and its relation with morphological structure was studied. Relation between interfacial adhesion strength, measured by peel test using Universal testing machine (UTM). |
| 저자 | 최원진, 최승혁, 이석규, 최봉구, 한학수 |
| 소속 | 연세대 |
| 키워드 | MCM-41; adhesion; Delectric constant; FCCL |
| 원문파일 | 초록 보기 |
