| 초록 |
Acrylic pressure-sensitive adhesives (PSAs) have many applications in electronic industry. As the Si-wafers become thinner, the acrylic PSAs need to show proper adhesion on the thin wafer without any damage. Easy debonding property is important for the protection of thin Si-wafers in the transporting process. In this work, the acrylic copolymers were synthesized by solution polymerization of 2-ethylhexyl acrylate, ethyl acrylate, and acrylic acid with AIBN as an initiator. Semi-IPN acrylic PSAs were prepared using glycidyl methacrylate (GMA) and lauryl glycidyl ether (LGE) using UV-curing system. The adhesion performance of UV-curable PSA was investigated using probe tack, peel strength, and cohesive test. The debonding property of PSA was improved with increasing GMA content after heat-treatment. |
