| 학회 |
한국고분자학회 |
| 학술대회 |
2010년 가을 (10/07 ~ 10/08, 대구 EXCO) |
| 권호 |
35권 2호 |
| 발표분야 |
고분자 가공/복합재료 |
| 제목 |
The preparation of modified epoxy system with the enhanced thermal properties. |
| 초록 |
The high thermal expansion property of epoxy system is known to cause the serious problems such as cracking, delamination and peeling in semiconductor packaging. Therefore, the preparation of the epoxy system with the enhanced thermal property is highly demanded, especially with the advance of semiconductor packaging technology In this work, we synthesized the new epoxy monomer with the side functional group and were cured with amine and imidazole. The CTE, Tg and hardness of epoxy cured systems were evaluated by TMA, DSC, and AFM, respectively. And the effects of functional group on thermal properties of epoxy systems were discussed. |
| 저자 |
전현애, 정민재, 강소영, 탁상용, 김윤주, 신승한
|
| 소속 |
한국생산기술(연) |
| 키워드 |
epoxy system; thermal property
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| E-Mail |
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