| 초록 |
Silver nanowires (AgNWs) are one of the most promising materials for flexible transparent conductive films (TCFs) to replace indium tin oxide (ITO); however, there are still numerous problems originating from poor AgNW junction formation and improper AgNW embedment into transparent substrates. To mitigate these problems, high temperature processes have been adopted; however, unwanted deformation prevents the use of these processes for flexible TCFs. In this work, we present a novel plasticized polymer interlayer to achieve a low temperature fabrication of AgNW-based TCF, which does not cause any deformation. By exploiting the viscoelastic property of the plasticized interlayer near the lowered glass transition temperature, the monolithic junction of the AgNWs on the interlayer and embedment of the inter-connected AgNWs into the interlayer are achieved in a single-step pressing. The resulting AgNW TCFs are highly transparent, conductive , and environmentally and mechanically robust. |
