화학공학소재연구정보센터
학회 한국화학공학회
학술대회 1997년 봄 (04/25 ~ 04/26, 동국대학교)
권호 3권 1호, p.61
발표분야 공업화학
제목 Epoxy-Aminosilane/MDA 계의 경화반응 속도론
초록 In this Paper, Differential scanning calorimetry (DSC) has been used to investigate thecure kinetics of epoxy-aminosilane/MDA system. The kinetic parameters were obtained fromthe dynamic DSC thermograms using Kissinger expressions. The experiment results shownthat the cure process of epoxy resin consisting of γ-APS (γ-aminopropyl triethoxysilane) ismainly controlled by noncatalystic mechanism. The addition of γ-APS can enhance the curerate due to its high reactivity as other primary aliphatic amines, but has little effect to theactivity energy.
저자 여만경, 김상욱
소속 서울시립대
키워드 Kinetic; Epoxy; DSC
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