| 학회 | 한국고분자학회 |
| 학술대회 | 2002년 봄 (04/12 ~ 04/13, 서울대학교) |
| 권호 | 27권 1호, p.216 |
| 발표분야 | 복합재료 |
| 제목 | Thermal and Mechanical Properties for Conductive Carbon Fiber/PEEK Composite for Biomedical Application by Electrical Resistance Measurement |
| 초록 | Thermoplastic polymers tend to change their microstructure with a thermal history. The studies on the relationship between thermal history and polymer structure, or properties are useful for developing manufacturing process. There are many methods for examining the structure and properties of a polymer, such as thermal analysis and rheological testing. These methods are applicable to small specimens. The measurement of electrical resistance can be performed by simple instrument and can be also applicable to large specimen size. Electrical resistance in composites can be dependent upon damage detection, curing monitoring, and stain-stress sensing. Carbon fiber/PEEK composite can be applied to biomedical implant materials as well as aerospace industry due to their excellent mechanical properties and biocompatibility. Their major advantage in biomedical application is also fully compatible with computed tomography (CT) and magnetic resonance imaging (MRI) because of the radio transparency. In this study, interfacial properties of carbon fiber/PEEK composite were evaluated using electro-micromechanical test. The changes of electrical resistance with thermal history were measured, and they were correlated with results of thermal analysis. Acknowledgement: This study was supported financially by KoSEF through ReCAPT, GNU. |
| 저자 | 김대식1, 박종만2 |
| 소속 | 1경상대, 2항공기부품기술연구센터 |
| 키워드 | |
