| 초록 |
Due to the development of smaller and thinner semiconductor packaging, the higher mechanical properties of photosensitive polyimide or polybenzoxazole, as the passivation layer or insulation interlayer on chip, are demanded. A photosensitive polybenzoxazole (PSPBO), based on a poly(o-hydroxy amide) (PHA), the photoactive compound (PAC), the dissolution controller, the coupling agent, the cross-linker, and the additives, was developed. The ends of PHA’s chain were capped by several kinds of end-cappers which were further able to react with cross-linker or other end of PHA during the cure process or not. The moderate chain expansion/cross-linking reaction could enhance mechanical properties, as tensile strength, modulus, and elongation which are important properties. |
