| 초록 |
Thin film encapsulation (TFE) was developed by alternative deposition of initiated chemical vapor deposition (iCVD) and atomic layer deposition (ALD). The fabricated multilayers demonstrated outstanding barrier performance; an estimated water vapor transmission rate (WVTR) below × 10-5 g m-2 day-1 under ambient condition. They were highly transparent, and the flexibility could be significantly enhanced to endure 10 r bending with structural optimization. With further improvement, the iCVD/ALD multilayer TFE is expected to be a promising candidate for the encapsulation of organic electronic devices. |
