| 초록 |
Improving toughness for delamination resistance, without sacrificing thermal resistance and maintaining its flowability of an epoxy resin for application in semiconductor encapsulation process has been challenging. we studied three block copolymers (BCP) of roughly the same weight average Molecular Weight and the same composition of Poly (Methyl methacrylate) and Poly (Butylacrylate) to enhance impact resistance of semiconductor packaging materials. The flowability, thermal stability and mechanical properties of the BCP modified epoxy composites were studied. The results show that the BCP modified epoxy composite maintained the flowability and thermal stability of the epoxy resin, while its delamination property, flexural strength and toughness index were significantly improved in comparison with the neat epoxy. It is believed that this study provides a new pathway for the toughening of epoxy matrix materials for advanced semiconductor packaging. |
