| 초록 |
Three-dimensional (3D) integration is natural progression of recent printing techniques with integrated processes for printed electronics. 3D printing can produce devices embedded within 3D structural materials or a high aspect ratio devices. Specific research challenges in multi-material related 3D printing might lead to a step change in technology. I will discuss about 3D printing’s technical challenges such as multi-materials deposition that have hindered broader adoption of the hightech manufacturing process. This talk will also suggest a future platform for a 3D printer system that combines different deposition methods including Fused Filament Fabrication, Liquid Paste Extrusion, and Aerosol Spray. By demonstration of novel platform of 3D integration, multi-material printing will become achievable for manufacturing technology which offers a new paradigm in the 3D integration of sensors or complex electronics within a single building process, promoting simple and low-cost electronics. |
