| 초록 |
The adhesion between tetrachlorobenzoquinone (TCBQ) loaded rubber compound and brass-plated steel cord was studied to understand the role of TCBQ as an adhesion promoter. With loading of TCBQ on rubber compound cure rate became slow, but the change in physical properties was not significant. An improvement of the adhesion was obvious with low loading of TCBQ at the range of 0.5 phr while an adverse effect was observed with high loading at 2 phr and aging treatments for 15 days. The addition of TCBQ for the improvement of adhesion property has a greater effect before aging because TCBQ contributes to form a large surface area of copper sulfide via accelerated copper diffusion into the rubber bulk. However, higher TCBQ loading as well as longer aging time leads to a great extent of copper migration into rubber and excess growth of zinc oxide layer, resulting in the decreased adhesion property. The adhesion interphase before aging, between a thin brass film and a rubber compound, investigated using AES showed no difference except that sulfur increased with increasing TCBQ loading. On the other hand, the adhesion interphase has been changed after humidity aging, showing copper content decreased at the adhesion interphase while increased in rubber layer with increasing the addition of TCBQ.
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