| 초록 |
Polyimide (PI) is an engineering plastic that is widely used in various devices owing to its good mechanical properties, excellent thermal stability, flexibility, chemical resistance and low dielectric permittivity. Recently, owing to the demands in denser and faster circuits in electronic devices, the dissipation of heat generated in electronic components has attracted more attention and is considered as a critical issue to be resolved. In this study, crosslinked PI was synthesized through PI containing DABA (3,5-diaminobenzoic acid) group. And a boron nitride-based crosslinked polyimide (PI-BN) nanocomposite was prepared as heat dissipation materials. Chemical crosslinking of PI may provide feasible routes for the improvement of the mechanical and thermal properties. The thermal conductivity and tensile strength according to the crosslinking density of PI and the content of BN were evaluated. |
