| 초록 |
Thin silver film is of great interest in electromagnetic interference shielding effectiveness (EMI SE) due to high electrical conductivity. However, the fabrication of the film has been a continuing challenge because of their tendency to form clusters rather than smooth continuous thin film. In this issue, we present the effect of Cu and Ni as a seed layer on the performance of smooth silver thin film as an efficient material for EMI SE. The silver film is fabricated by dry plasma reduction (DPR) on PET substrate, which was modified by a monolayer of Cu or Ni nanoparticles, from AgNO3 solution under atmospheric pressure and low temperature. The morphology and thickness of the silver film are characterized through HRSEM. The formation of silver film is examined using XRD and XPS analyses. The conductivity of the silver film is measured by four-point probe method. As a result, the smooth silver thin film is successfully fabricated on PET substrate via DPR with assistance of Ni or Cu seed-coated PET substrates. The developed silver thin films show better EMI SE compared to the film prepared by the same procedure without using seed layers. |
