| 초록 |
The protecting film is very important for electronic devices because they are easily affected by oxygen and moisture in air and it results to inaccurate operation. To combine protecting film and electric device, hot melt process have been commonly used but it need the special equipment and the restrictive usage temperature and viscosity of adhesive. Here, we report lamination process as the method to combine protection film and flexible electric devices using UV curing system. Substrate was covered with protection film and they were bonded together by UV curing. Its transparency and haze did not collapse due to the usage of transparent curing adhesive. The durability of lamination, examined by repeated bending test, showed the diverse results according to curing time, adhesive, and the type of film. |
