| 학회 | 한국공업화학회 |
| 학술대회 | 2021년 봄 (05/12 ~ 05/14, 부산 벡스코(BEXCO)) |
| 권호 | 25권 1호 |
| 발표분야 | [도료·코팅] 유연 디스플레이용 접착 코팅 기술 및 현황 |
| 제목 | Coatings and Adhesives for polyimide |
| 초록 | Polyimide (PI) is a polymer with imide rings (-CO-N-CO-) belonging to the class of super performance engineering polymers. Since polyimide was developed by DuPont in the 1950s, it has been applied to various industrial fields such as aerospace, semiconductors, and displays due to lightweight, flexibility, resistant to heat and chemicals. Recently, polyimide is in the spotlight as a flexible substrate material for displays and various electric devices, and many research are being conducted. Generally, polyimide is prepared by thermal imidization after polyamic acid is prepared by condensation polymerization of diamine and dianhydride. We have studied for the structure and synthesis of polyimide, and have developed for the coating and adhesion to the substrate. |
| 저자 | 최성묵 |
| 소속 | (주)피엔에스테크놀로지 |
| 키워드 | polyimide; display; flexible; |
