| 1 |
Application of a nickel hydroxide gold nanoparticles screen-printed electrode for impedimetric sensing of glucose in artificial saliva
Rinaldi AL, Rodriguez-Castellon E, Sobral S, Carballo R
Journal of Electroanalytical Chemistry, 832, 209, 2019 |
| 2 |
Effect of calcination parameters on behavior of bone hydroxyapatite in artificial saliva and its biosafety
Sobczak-Kupiec A, Olender E, Malina D, Tyliszczak B
Materials Chemistry and Physics, 206, 158, 2018 |
| 3 |
Is niobium more corrosion-resistant than commercially pure titanium in fluoride-containing artificial saliva?
Li Y, Xu J
Electrochimica Acta, 233, 151, 2017 |
| 4 |
A green microextraction method in a narrow glass column for copper in artificial saliva extract of smokeless tobacco products
Arain SS, Kazi TG, Afridi HI, Naeemullah, Brahman KD, Arain MB, Panhwar AH, Arain MS, Baloch S
Journal of Industrial and Engineering Chemistry, 34, 27, 2016 |
| 5 |
Repassivation behavior of titanium in artificial saliva investigated with a photon rupture method
Sakairi M, Kinjyo M, Kikuchi T
Electrochimica Acta, 56(4), 1786, 2011 |
| 6 |
Electrochemical behavior of Ti-20Cr-X alloys in artificial saliva containing fluoride
Ho WF, Wu SC, Lin CW, Hsu SK, Hsu HC
Journal of Applied Electrochemistry, 41(3), 337, 2011 |
| 7 |
Characterization of Streptococcus salivarius growth and maintenance in artificial saliva
Roger P, Delettre J, Bouix M, Beal C
Journal of Applied Microbiology, 111(3), 631, 2011 |
| 8 |
Electrochemical behavior of Calcium Titanate Coated Ti-6Al-4V Substrate in Artificial Saliva
Lee BC, Balakrishnan A, Ko MW, Choi JW, Park JK, Kim TN
Korean Journal of Materials Research, 18(1), 22, 2008 |
| 9 |
Evaluation of microbially influenced corrosion with electrochemical noise analysis and signal processing
Zaveri N, Sun RT, Zufelt N, Zhou AH, Chen YQ
Electrochimica Acta, 52(19), 5795, 2007 |
| 10 |
In-vitro Hertzian fatigue properties of glass infiltrated ceramic composites for dental crowns
Song YS, Park I, Jang JW, Lee DY, Lee SJ
Materials Science Forum, 486-487, 225, 2005 |
