검색결과 : 1건
| No. | Article |
|---|---|
| 1 |
Evaluation of BCB bonded and thinned wafer stacks for three-dimensional integration Kwon Y, Jindal A, Augur R, Seok J, Cale TS, Gutmann RJ, Lu JQ Journal of the Electrochemical Society, 155(5), H280, 2008 |
| No. | Article |
|---|---|
| 1 |
Evaluation of BCB bonded and thinned wafer stacks for three-dimensional integration Kwon Y, Jindal A, Augur R, Seok J, Cale TS, Gutmann RJ, Lu JQ Journal of the Electrochemical Society, 155(5), H280, 2008 |