검색결과 : 5건
| No. | Article |
|---|---|
| 1 |
Effect of Pad Surface Micro-Texture on Coefficient of Friction and Removal Rate during Copper CMP Process Liao X, Zhuang Y, Borucki LJ, Theng S, Wei X, Ashizawa T, Philipossian A Electrochemical and Solid State Letters, 14(5), H201, 2011 |
| 2 |
Fluid pressures and pad topography in chemical mechanical polishing Borucki LJ, Ng SH, Danyluk S Journal of the Electrochemical Society, 152(5), G391, 2005 |
| 3 |
Topography simulation for the virtual wafer fab Cale TS, Merchant TP, Borucki LJ, Labun AH Thin Solid Films, 365(2), 152, 2000 |
| 4 |
Multiple scale integrated modeling of deposition processes Merchant TP, Gobbert MK, Cale TS, Borucki LJ Thin Solid Films, 365(2), 368, 2000 |
| 5 |
A Multiscale Simulator for Low-Pressure Chemical-Vapor-Deposition Gobbert MK, Merchant TP, Borucki LJ, Cale TS Journal of the Electrochemical Society, 144(11), 3945, 1997 |