| 1 |
Insight into the mechanism of alloying elements (Sn, Be) effect on copper corrosion during long-term degradation in harsh marine environment
Kong DC, Dong CF, Ni XQ, Man C, Xiao K, Li XG
Applied Surface Science, 455, 543, 2018 |
| 2 |
Surface investigation of naturally corroded gilded copper-based objects
Ingo GM, Riccucci C, Lavorgna M, de Luna MS, Pascucci M, Carlo G
Applied Surface Science, 387, 244, 2016 |
| 3 |
XRMON-SOL: Isothermal equiaxed solidification of a grain refined Al-20 wt%Cu alloy
Murphy AG, Mathiesen RH, Houltz Y, Li J, Lockowandt C, Henriksson K, Zimmermann G, Melville N, Browne DJ
Journal of Crystal Growth, 440, 38, 2016 |
| 4 |
Synergistic effects of alloying elements in Cu-ternary alloys in chloride solutions
Badawy WA, El-Rabiei MM, Nady H
Electrochimica Acta, 120, 39, 2014 |
| 5 |
Surface study of films formed on copper and brass at open circuit potential
Procaccini R, Schreiner WH, Vazquez M, Cere S
Applied Surface Science, 268, 171, 2013 |
| 6 |
The use of cysteine, N-acetyl cysteine and methionine as environmentally friendly corrosion inhibitors for Cu-10Al-5Ni alloy in neutral chloride solutions
Abd El-Hafez GM, Badawy WA
Electrochimica Acta, 108, 860, 2013 |
| 7 |
Evaluation of biocidal efficacy of copper alloy coatings in comparison with solid metal surfaces: generation of organic copper phosphate nanoflowers
Gutierrez H, Portman T, Pershin V, Ringuette M
Journal of Applied Microbiology, 114(3), 680, 2013 |
| 8 |
An investigation into the tribological performance of Physical Vapour Deposition (PVD) coatings on high thermal conductivity Cu-alloy substrates and the effect of an intermediate electroless Ni-P layer prior to PVD treatment
Wilson JCAB, Banfield S, Eichler J, Leyland A, Matthews A, Housden J
Thin Solid Films, 520(7), 2922, 2012 |
| 9 |
Metal Reaction Doping and Ohmic Contact with Cu-Mn Electrode on Amorphous In-Ga-Zn-O Semiconductor
Yun PS, Koike J
Journal of the Electrochemical Society, 158(10), H1034, 2011 |
| 10 |
Dealloyed Pt Nanoparticle Fuel Cell Electrocatalysts: Stability and Aging Study of Catalyst Powders, Thin Films, and Inks
Koh S, Strasser P
Journal of the Electrochemical Society, 157(4), B585, 2010 |
