| 1 |
Fabrication of W-Cu functionally graded composites using high energy ball milling and spark plasma sintering for plasma facing components
Pillari LK, Bakshi SR, Chaudhuri P, Murty BS
Advanced Powder Technology, 31(8), 3657, 2020 |
| 2 |
Non-enzymatic electrochemical sensor based on Cu2O/AuCu/Cu composite for hydrogen peroxide detection
Liang XY, Li WX, Han HL, Ma ZF
Journal of Electroanalytical Chemistry, 834, 43, 2019 |
| 3 |
A simple two-step fabrication route for Cu composite reinforced by three-dimensional graphene network
Kawk SR, Ring TA, Choi BS
Journal of Industrial and Engineering Chemistry, 70, 484, 2019 |
| 4 |
Fabricating and strengthening the carbon nanotube/copper composite fibers with high strength and high electrical conductivity
Han BS, Guo EY, Xue X, Zhao ZY, Li TJ, Xu YJ, Luo LS, Hou HL
Applied Surface Science, 441, 984, 2018 |
| 5 |
An experimental investigation of bonding strengths for plasma facing components
Jiang J, Zhang QL, Shen WP
International Journal of Energy Research, 42(3), 1013, 2018 |
| 6 |
Structural effect of Ni-Cu catalysts for graphene growth by pulsed laser deposition
Abd Elhamid AM, Aboulfotouh AM, Hafez MA, Azzouz IM
Thin Solid Films, 653, 93, 2018 |
| 7 |
Effect of Cu content and heat treatment on the properties and microstructure of W-Cu composites produced by hot extrusion with steel cup
Yu Y, Zhang WC, Yu H
Advanced Powder Technology, 26(4), 1047, 2015 |
| 8 |
The influence of TiB2 content on microstructure and properties of W-30Cu composites prepared by electroless plating and powder metallurgy
Huang LM, Luo LM, Cheng JG, Zhu XY, Wu YC
Advanced Powder Technology, 26(4), 1058, 2015 |
| 9 |
Effects of simplified pretreatment process on the morphology of W-Cu composite powder prepared by electroless plating and its sintering characterization
Huang LM, Luo LM, Ding XY, Luo GN, Zan X, Cheng JG, Wu YC
Powder Technology, 258, 216, 2014 |
| 10 |
Cu2O microsphere, microspherical composite of Cu2O/Cu nanocrystals and various Cu microcrystals: In situ hydrothermal conversion of Cu-aminodiphosphonate complexes
Dehghanpour S, Mahmoudi A, Mirsaeed-Ghazi M, Bazvand N, Shadpour S, Nemati A
Powder Technology, 246, 148, 2013 |
