| 1 |
Interpolymer complexes of poly(acrylic acid) and poly(ethylene glycol) for low dishing in STI CMP
Seo J, Moon J, Moon S, Paik U
Applied Surface Science, 353, 499, 2015 |
| 2 |
Experimental and theoretical characterization of deep penetration welding threshold induced by 1-mu m laser
Zou JL, He Y, Wu SK, Huang T, Xiao RS
Applied Surface Science, 357, 1522, 2015 |
| 3 |
Functions of Trilon (R) P as a polyamine in copper chemical mechanical polishing
Jiang L, Lan YQ, He YY, Li YZ, Luo JB
Applied Surface Science, 288, 265, 2014 |
| 4 |
계면활성제 함량 조절을 통한 구리 하이브리드 구조물의 화학 기계적 평탄화
장수천, 안준호, 박재홍, 정해도
Korean Journal of Materials Research, 22(11), 587, 2012 |
| 5 |
Potassium sorbate as an inhibitor in copper chemical mechanical planarization slurries. Part II: Effects of sorbate on chemical mechanical planarization performance
Nagar M, Vaes J, Ein-Eli Y
Electrochimica Acta, 55(8), 2810, 2010 |
| 6 |
Novel slurry solution for dishing elimination in copper process beyond 0.1-mu m technology
Chen KW, Wang YL, Liu CP, Chang L, Li FY
Thin Solid Films, 498(1-2), 50, 2006 |
| 7 |
Effect of slurry pH on the defects induced during the plug isolation chemical mechanical polishing
Lee WJ, Ko CH
Thin Solid Films, 489(1-2), 145, 2005 |
| 8 |
A feature scale model for chemical mechanical planarization of damascene structures
Saxena R, Thakurta DG, Gutmann RJ, Gill WN
Thin Solid Films, 449(1-2), 192, 2004 |
| 9 |
Novel compensation chemical metal polishing for low dishing and high global planarity for ultra-planar die applications in micro-optics and micro-electro-mechanical systems
Ganguly U, Krusius JP
Thin Solid Films, 460(1-2), 306, 2004 |
