검색결과 : 6건
| No. | Article |
|---|---|
| 1 |
Tribo-electrochemical characterization of copper thin films Joo S, Liang H Electrochimica Acta, 99, 133, 2013 |
| 2 |
Material removal mechanisms in electrochemical-mechanical polishing of tantalum Gao F, Liang H Electrochimica Acta, 54(27), 6808, 2009 |
| 3 |
An investigation of phosphate based ECMP electrolyte performance on feature scale planarization Shattuck KG, West AC Journal of Applied Electrochemistry, 39(10), 1719, 2009 |
| 4 |
Characterization of phosphate electrolytes for use in Cu electrochemical mechanical planarization Shattuck KG, Lin JY, Cojocaru P, West AC Electrochimica Acta, 53(28), 8211, 2008 |
| 5 |
Investigation of dissolution inhibitors for electrochemical mechanical planarization of copper using beta-alanine as a complexing agent Klug BK, Pettit CM, Pandija S, Babu SV, Roy D Journal of Applied Electrochemistry, 38(10), 1347, 2008 |
| 6 |
Cu ECMP 공정에서 전해액이 연마거동에 미치는 영향 권태영, 김인권, 김태곤, 조병권, 박진구 Korean Journal of Materials Research, 18(6), 334, 2008 |