검색결과 : 42건
| No. | Article |
|---|---|
| 1 |
Synthesis of a novel polymer cholesterol-poly(ethylene glycol) 2000-glycyrrhetinic acid (chol-PEG-GA) and its application in brucine liposome Chen ZP, Xiao L, Liu D, Feng MS, Xiao YY, Chen J, Li W, Li WD, Cai BC Journal of Applied Polymer Science, 124(6), 4554, 2012 |
| 2 |
Study on pressure-independent Cu removal in Cu abrasive-free polishing Fang JY, Huang PW, Tsai MS, Dai BT, Wu YS, Feng MS Electrochemical and Solid State Letters, 9(1), G13, 2006 |
| 3 |
Effect of surface passivation removal on planarization efficiency in Cu abrasive-free polishing Fang JY, Tsai MS, Dai BT, Wu YS, Feng MS Journal of the Electrochemical Society, 153(1), G44, 2006 |
| 4 |
High-selectivity damascene chemical mechanical polishing Chiu SY, Wang YL, Liu CP, Chang SC, Hwang GJ, Feng MS, Chen CF Thin Solid Films, 498(1-2), 60, 2006 |
| 5 |
Pattern effect optimized with non-native surface passivation in copper abrasive-free polishing Fang JY, Tsai MS, Dai BT, Wu YS, Feng MS Electrochemical and Solid State Letters, 8(5), G128, 2005 |
| 6 |
Aplication of plasma immersion ion implantation on seeding copper electroplating for multilevel interconnection Chiu SY, Wang YL, Chang SC, Feng MS Thin Solid Films, 478(1-2), 293, 2005 |
| 7 |
Effect of deposition temperature, on thermal stability in high-density plasma chemical vapor deposition fluorine-doped silicon dioxide Cheng YL, Wang YL, Chen HW, Lan JL, Liu CP, Wu SA, Wu YL, Lo KY, Feng MS Journal of Vacuum Science & Technology A, 22(3), 494, 2004 |
| 8 |
Roles of copper mechanical characteristics in electropolishing Chang SC, Shieh JM, Fang JY, Wang YL, Dai BT, Feng MS Journal of Vacuum Science & Technology B, 22(1), 116, 2004 |
| 9 |
Optimization of post-N-2 treatment and undoped-Si-glass cap to improve metal wring delamination in deep submicron high-density plasma-fluorinated silica glass intermetal dielectric application Cheng YL, Wang YL, Lan JK, Wu SA, Chang SC, Lo KY, Feng MS Journal of Vacuum Science & Technology B, 22(4), 1792, 2004 |
| 10 |
Integration of a stack of two fluorine doped silicon oxide film with ULSI interconnect metallization Cheng YL, Wang YL, Liu CP, Wu YL, Lo KY, Liu CW, Lan JK, Ay C, Feng MS Materials Chemistry and Physics, 83(1), 150, 2004 |