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| No. | Article |
|---|---|
| 1 |
Enhanced Chemical-Vapor-Deposition of Copper from (Hfac)Cu(Tmvs) Using Liquid Coinjection of Tmvs Petersen GA, Parmeter JE, Apblett CA, Gonzales MF, Smith PM, Omstead TR, Norman JA Journal of the Electrochemical Society, 142(3), 939, 1995 |