화학공학소재연구정보센터
검색결과 : 8건
No. Article
1 Upgrading copper slag cleaning tailings for re-use
Holland K, Eric RH, Taskinen P, Jokilaakso A
Minerals Engineering, 133, 35, 2019
2 Characterization of thermoset and thermoplastic polyurethane pads, and molded and non-optimized machined grooving methods for oxide chemical mechanical planarization applications
Sampurno Y, Borucki L, Zhuang Y, Misra S, Holland K, Boning D, Philipossian A
Thin Solid Films, 517(5), 1719, 2009
3 Selectivity switch concept in Cu chemical mechanical planarization and its implementation on orbital tools
Gotkis Y, Alamgir S, Yang L, Dai F, Mitchell F, Nguyen J, Shumway L, Walesa LR, Yang J, Nunan P, Holland K
Journal of Vacuum Science & Technology B, 17(5), 2262, 1999
4 Optical endpoint detection for chemical mechanical planarization
Bibby T, Adams JA, Holland K
Journal of Vacuum Science & Technology B, 17(5), 2378, 1999
5 CWA helps treat chem wastewater
Holland K, Mullan JD
Chemical Processing, 61(10), 67, 1998
6 Von-Mises Stress in Chemical-Mechanical Polishing Processes
Wang D, Lee J, Holland K, Bibby T, Beaudoin S, Cale T
Journal of the Electrochemical Society, 144(3), 1121, 1997
7 Stress distribution in chemical mechanical polishing
Srinivasa-Murthy C, Wang D, Beaudoin SP, Bibby T, Holland K, Cale TS
Thin Solid Films, 308-309, 533, 1997
8 CMP CoO reduction : slurry reprocessing
Bibby TFA, Adams JA, Holland K, Krulik GA, Parikh P
Thin Solid Films, 308-309, 538, 1997