검색결과 : 9건
| No. | Article |
|---|---|
| 1 |
Annealing and Impurity Effects in Co Thin Films for MOL Contact and BEOL Metallization Kelly J, Kamineni V, Lin X, Pacquette A, Hopstaken M, Liang Y, Amanapu H, Peethala B, Jiang L, Demarest J, Shobha H, Raymond M, Haran B Journal of the Electrochemical Society, 166(1), D3100, 2018 |
| 2 |
Effects of the incorporation of alkali elements on Cu(In,Ga)Se-2 thin film solar cells Shin D, Kim J, Gershon T, Mankad R, Hopstaken M, Guha S, Ahn BT, Shin B Solar Energy Materials and Solar Cells, 157, 695, 2016 |
| 3 |
Tin Incorporated in Copper Films during Damascene Copper Electrodeposition Kitayaporn S, Huang Q, Hopstaken M, Baker-O'Neal B Journal of the Electrochemical Society, 162(1), D74, 2015 |
| 4 |
High Efficiency Cu2ZnSn(S,Se)(4) Solar Cells by Applying a Double In2S3/CdS Emitter Kim J, Hiroi H, Todorov TK, Gunawan O, Kuwahara M, Gokmen T, Nair D, Hopstaken M, Shin B, Lee YS, Wang W, Sugimoto H, Mitzi DB Advanced Materials, 26(44), 7427, 2014 |
| 5 |
A Diffusion Barrier for Flexible Thin Film Photovoltaics Guo L, Mason M, Hopstaken M, Kellock A, Romankiw LT, Deligianni H Journal of the Electrochemical Society, 160(3), D102, 2013 |
| 6 |
Enhanced Grain Growth of Electroplated Copper on Cobalt-Containing Seed Layer Huang Q, Baker-O'Neal BC, Cabral C, Simonyi E, Deline VR, Hopstaken M Journal of the Electrochemical Society, 160(12), D3045, 2013 |
| 7 |
Leveler Effect and Oscillatory Behavior during Copper Electroplating Huang Q, Baker-O'Neal BC, Parks C, Hopstaken M, Fluegel A, Emnet C, Arnold M, Mayer D Journal of the Electrochemical Society, 159(9), D526, 2012 |
| 8 |
CMOS compatible self-aligned S/D regions for implant-free InGaAs MOSFETs Czornomaz L, El Kazzi M, Hopstaken M, Caimi D, Machler P, Rossel C, Bjoerk M, Marchiori C, Siegwart H, Fompeyrine J Solid-State Electronics, 74, 71, 2012 |
| 9 |
N-2 as carrier gas: an alternative to H-2 for enhanced epitaxy of Si, SiGe and SiGe : C Meunier-Beillard P, Caymax M, Van Nieuwenhuysen K, Doumen G, Brijs B, Hopstaken M, Geenen L, Vandervorst W Applied Surface Science, 224(1-4), 31, 2004 |