| 1 |
Experimental Model Validation of High Aspect Ratio Through-Hole Filling by Additive-Assisted Copper Electrodeposition
Johnson MT, Keck CHC, Faber KT
Journal of the Electrochemical Society, 164(2), D48, 2017 |
| 2 |
Modeling Macro-Sized, High Aspect Ratio Through-Hole Filling by Multi-Component Additive-Assisted Copper Electrodeposition
Childers AS, Johnson MT, Ramirez-Rico J, Faber KT
Journal of the Electrochemical Society, 160(12), D3093, 2013 |
| 3 |
Polymeric drug carriers functionalized with pairwise arranged hydroxyl and/or carboxyl groups for platinum chelation
Johnson MT, Komane LL, N'Da DD, Neuse EW
Journal of Applied Polymer Science, 96(1), 10, 2005 |
| 4 |
Behavior of MgFe2O4 films on MgO in an electric field
Johnson MT, Carter CB, Schmalzried H
Journal of the American Ceramic Society, 83(7), 1768, 2000 |
| 5 |
AlN films grown by electric field induced flux of Al cations
Johnson MT, Carter CB
Thin Solid Films, 339(1-2), 117, 1999 |
| 6 |
The effect of an applied electric field on a heterogeneous solid-state reaction
Johnson MT, Schmalzried H, Carter CB
Solid State Ionics, 101-103, 1327, 1997 |
