| 1 |
Interaction of a Hydrated Electron with Anthracenethiosemicarbazone: A Pulse Radiolysis Study
Kate AN, Kumbhar AA, Sapre AV, Peerannawar SR, Gejji SP
Journal of Physical Chemistry A, 117(26), 5447, 2013 |
| 2 |
Synthesis, Electronic Structure, DNA and Protein Binding, DNA Cleavage, and Anticancer Activity of Fluorophore-Labeled Copper(II) Complexes
Bhat SS, Kumbhar AA, Heptullah H, Khan AA, Gobre VV, Gejji SP, Puranik VG
Inorganic Chemistry, 50(2), 545, 2011 |
| 3 |
Bis(maltolato)vanadium(III)-Polypyridyl Complexes: Synthesis, Characterization, DNA Cleavage, and Insulin Mimetic Activity
Islam MN, Kumbhar AA, Kumbhar AS, Zeller M, Butcher RJ, Dusane MB, Joshi BN
Inorganic Chemistry, 49(18), 8237, 2010 |
| 4 |
Maintaining Cu metal integrity on low-k IMDs with a nanometer thick a-SiC : H film obtained by HWCVD
Singh SK, Kumbhar AA, Dusane RO
Thin Solid Films, 516(5), 785, 2008 |
| 5 |
Aluminum-induced in situ crystallization of HWCVD a-Si : H films
Gupta S, Chelawat H, Kumbhar AA, Adhikari S, Dusane RO
Thin Solid Films, 516(5), 850, 2008 |
| 6 |
Hydrolytic cleavage of DNA by a ruthenium(II) polypyridyl complex
Deshpande MS, Kumbhar AA, Kumbhar AS
Inorganic Chemistry, 46(14), 5450, 2007 |
| 7 |
Hot-wire chemical-vapor-deposited nanometer range a-SiC : H diffusion barrier films for ultralarge-scale-integrated application
Singh SK, Kumbhar AA, Dusane RO, Bock W
Journal of Vacuum Science & Technology B, 24(2), 543, 2006 |
| 8 |
Potential of Cat-CVD deposited a-SiC : H as diffusion barrier layer on low-k HSQ films for ULSI
Singh SK, Kumbhar AA, Kothari M, Dusane RO
Thin Solid Films, 501(1-2), 318, 2006 |
| 9 |
Enhancement of moisture resistance of spin-on low-k HSQ films by hot wire generated atomic hydrogen treatment
Kumbhar AA, Singh SK, Dusane RO
Thin Solid Films, 501(1-2), 329, 2006 |
| 10 |
Highly conducting doped poly-Si deposited by hot wire CVD and its applicability as gate material for CMOS devices
Patil SB, Vairagar AV, Kumbhar AA, Sahu LK, Rao VR, Venkatramani N, Dusane RO, Schroeder B
Thin Solid Films, 430(1-2), 63, 2003 |
