검색결과 : 10건
| No. | Article |
|---|---|
| 1 |
Lapping flow and starting plume on an evenly heated horizontal plate Jiang YH, Nie BC, Xu F International Journal of Heat and Mass Transfer, 138, 235, 2019 |
| 2 |
Optimization of lapping processes of silicon wafer for photovoltaic applications Ozturk S, Aydin L, Kucukdogan N, Celik E Solar Energy, 164, 1, 2018 |
| 3 |
Effect of lapping slurry on critical cutting depth of spinel Wang ZK, Wang ZK, Zhu YW, Su JX Applied Surface Science, 347, 849, 2015 |
| 4 |
Surface behavior during abrasive grain action in the glass lapping process Belkhir N, Bouzid D, Herold V Applied Surface Science, 255(18), 7951, 2009 |
| 5 |
In situ low-angle cross sectioning: Bevel slope flattening due to self-alignment effects Scheithauer U Applied Surface Science, 255(22), 9062, 2009 |
| 6 |
웨이퍼의 2단 이면공정이 반도체 칩의 휨 강도에 미치는 영향 이성민 Korean Journal of Materials Research, 15(3), 183, 2005 |
| 7 |
Research on ultra-precision process of STAVAX ESR Yuan JL, Lou FY, Wang ZW, Chang M, Du WP, Tao BC Materials Science Forum, 471-472, 63, 2004 |
| 8 |
Research on ultra-precision machining technology for KTP Yuan JL, Lou FY, Wang ZW, Chang M, Du WP, De QF Materials Science Forum, 471-472, 473, 2004 |
| 9 |
AFM and photoluminescence characterization of defects in the mirror-polished ZnSe bulk crystals and MBE-grown homoepitaxial layers Kishino M, Taguchi T Journal of Crystal Growth, 210(1-3), 230, 2000 |
| 10 |
Damage-free surface modification of hexagonal silicon carbide wafers Chandler TC, Lari MB, Sudarshan TS Materials Science Forum, 338-3, 845, 2000 |