검색결과 : 4건
| No. | Article |
|---|---|
| 1 |
Texture and surface morphology improvement of Al by two-stage chemical vapor deposition and its integration in an Al plug-interconnect scheme for sub 0.25 mu m metallization Naik M, Guo T, Chen L, Mosely R, Beinglass I Journal of Vacuum Science & Technology A, 16(3), 1233, 1998 |
| 2 |
Nucleation and growth of CVD Al on different types of TiN Avinun M, Barel N, Kaplan WD, Eizenberg M, Naik M, Guo T, Chen LY, Mosely R, Littau K, Zhou S, Chen L Thin Solid Films, 320(1), 67, 1998 |
| 3 |
A low temperature integrated aluminum metallization technology for ULSI devices Guo T, Chen LY, Brown D, Besser P, Voss S, Mosely R Thin Solid Films, 332(1-2), 319, 1998 |
| 4 |
Chemical-Vapor-Deposited Ticn - A New Barrier Metallization for Submicron via and Contact Applications Eizenberg M, Littau K, Ghanayem S, Liao M, Mosely R, Sinha AK Journal of Vacuum Science & Technology A, 13(3), 590, 1995 |