검색결과 : 3건
| No. | Article |
|---|---|
| 1 |
Effect of process parameters on via formation in Si using deep reactive ion etching Abhulimen IU, Polamreddy S, Burkett S, Cai L, Schaper L Journal of Vacuum Science & Technology B, 25(6), 1762, 2007 |
| 2 |
Copper electroplating to fill blind vias for three-dimensional integration Spiesshoefer S, Patel J, Lam T, Cai L, Polamreddy S, Figueroa RF, Burkett SL, Schaper L, Geil R, Rogers B Journal of Vacuum Science & Technology A, 24(4), 1277, 2006 |
| 3 |
Process integration for through-silicon vias Spiesshoefer S, Rahman Z, Vangara G, Polamreddy S, Burkett S, Schaper L Journal of Vacuum Science & Technology A, 23(4), 824, 2005 |