1 |
5th International Conference on Spectroscopic Ellipsometry (ICSE-V) Preface Tompkins HG, Diebold A, Jellison GE, Collins R, Aspnes D Thin Solid Films, 519(9), 2569, 2011 |
2 |
Survey of methods to characterize thin absorbing films with Spectroscopic Ellipsometry Hilfiker JN, Singh N, Tiwald T, Convey D, Smith SM, Baker JH, Tompkins HG Thin Solid Films, 516(22), 7979, 2008 |
3 |
Measuring the thickness of organic/polymer/biological films on glass substrates using spectroscopic ellipsometry Tompkins HG, Tiwald T, Bungay C, Hooper AE Journal of Vacuum Science & Technology A, 24(4), 1605, 2006 |
4 |
Use of molecular vibrations to analyze very thin films with infrared ellipsometry Tompkins HG, Tiwald T, Bungay C, Hooper AE Journal of Physical Chemistry B, 108(12), 3777, 2004 |
5 |
Industrial applications of spectroscopic ellipsometry Tompkins HG Thin Solid Films, 455-56, 772, 2004 |
6 |
Synergism of transmission measurements with spectroscopic ellipsometry measurements in the analysis of a nearly opaque bimetal film stack on glass Tompkins HG, Tasic S Journal of Vacuum Science & Technology A, 18(3), 946, 2000 |
7 |
Analysis of silicon oxynitrides with spectroscopic ellipsometry and Auger spectroscopy, compared to analyses by Rutherford backscattering spectrometry and Fourier transform infrared spectroscopy Tompkins HG, Gregory RB, Deal PW, Smith SM Journal of Vacuum Science & Technology A, 17(2), 391, 1999 |
8 |
Determining thickness of thin metal films with spectroscopic ellipsometry for applications in magnetic random-access memory Tompkins HG, Zhu T, Chen E Journal of Vacuum Science & Technology A, 16(3), 1297, 1998 |
9 |
5 Layer Stack of Nitride, Oxide, and Amorphous-Silicon on Glass, Analyzed with Spectroscopic Ellipsometry Tompkins HG, Williams PH Journal of Vacuum Science & Technology A, 15(3), 992, 1997 |
10 |
Uniform low stress oxynitride films for application as hardmasks on x-ray masks Dauksher WJ, Resnick DJ, Smith SM, Pendharkar SV, Tompkins HG, Cummings KD, Seese PA, Mangat PJS, Chan JA Journal of Vacuum Science & Technology B, 15(6), 2232, 1997 |