검색결과 : 9건
No. | Article |
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1 |
Ultrafast deposition of silicon nitride and semiconductor silicon thin films by hot wire chemical vapor deposition Schropp REI, van der Werf CHM, Verlaan V, Rath JK, Li H Thin Solid Films, 517(10), 3039, 2009 |
2 |
Reversibility of silicidation of Ta filaments in HWCVD of thin film silicon van der Werf CHM, Li H, Verlaan V, Oliphant CJ, Bakker R, Houweling ZS, Schropp REI Thin Solid Films, 517(12), 3431, 2009 |
3 |
Effect of ammonia on Ta filaments in the hot wire CVD process Verlaan V, van der Werf CHM, Oliphant CJ, Bakker R, Houweling ZS, Schropp REI Thin Solid Films, 517(12), 3435, 2009 |
4 |
The effect of composition on the bond structure and refractive index of silicon nitride deposited by HWCVD and PECVD Verlaan V, Verkerk AD, Arnoldbik WM, van der Werf CHM, Bakker R, Houweling ZS, Romijn IG, Borsa DM, Weeber AW, Luxembourg SL, Zeman M, Dekkers HFW, Schropp REI Thin Solid Films, 517(12), 3499, 2009 |
5 |
Heat transfer model of an iCVD reactor Bakker R, Verlaan V, Verkerk AD, van der Werf CHM, van Dijk L, Rudolph H, Rath JK, Schropp REI Thin Solid Films, 517(12), 3555, 2009 |
6 |
Formation of isolated carbon nanofibers with hot-wire CVD using nanosphere lithography as catalyst patterning technique Houweling ZS, Verlaan V, ten Grotenhuis GT, Schropp REI Thin Solid Films, 517(12), 3566, 2009 |
7 |
All hot wire CVD TFTs with high deposition rate silicon nitride (3 nm/s) Schropp REI, Nishizaki S, Houweling ZS, Verlaan V, van der Werf CHM, Matsumura H Solid-State Electronics, 52(3), 427, 2008 |
8 |
Hot Wire CVD for thin film triple junction cells and for ultrafast deposition of the SiN passivation layer on polycrystalline Si solar cells Schropp REI, Franken RH, Goldbach HD, Houweling ZS, Li H, Rath JK, Schuettauf JWA, Stolk RL, Verlaan V, van der Werf CHM Thin Solid Films, 516(5), 496, 2008 |
9 |
Deposition of device quality silicon nitride with ultra high deposition rate (> 7 nm/s) using hot-wire CVD Verlaan V, Houweling ZS, van der Werf CHM, Romijn IG, Weeber AW, Goldbach HD, Schropp REI Thin Solid Films, 516(5), 533, 2008 |